Product detail:
| Backing material | Polyimide |
| Type of adhesive | silicone |
| Total thickness | 62 µm |
Properties:
| Temperature resistance | 260 °C |
| Elongation at break | 35 % |
| Tensile strength | 40 N/cm |
| Dielectric breakdown voltage | 6000 V |
| Insulation class | H |
| Adhesion to Steel | 2.5 N/cm |
- High chemical resistance and dielectric strength
- Residue-free removability for masking applications
- Flame retardant according to UL510 and DIN EN 60454-2 (VDE 0340-2):2008-05, clause 20
- High temperature resistance (up to 260°C)
- tesa® 51407 is recommended for high temperature masking, e.g. powder coating, galvanizing
- The standard grade polyimide tape can be used for chemical production processes and wave soldering, e.g. during circuit board assembly
- Suitable for masking of 3D printing beds or electrical and thermal insulation, e.g. wire-or cable-wrapping
